| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10668395 | Surface and Coatings Technology | 2011 | 6 Pages |
Abstract
⺠Cu-Si3N4 composite layers were obtained by electrodeposition. ⺠Particle concentration and stirring influenced the amount of embedded particles. ⺠The composites had higher strength but lower ductility than pure copper.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Alain Robin, Júlio Cesar Pinheiro de Santana, Antonio Fernando Sartori,