Article ID Journal Published Year Pages File Type
10669728 Thin Solid Films 2014 6 Pages PDF
Abstract
A tri-layer nano-scale metallic multilayer (Cu/Ni/Nb) system with a mixture of incoherent and coherent interfaces was investigated to determine the effect of elevated temperature conditions on the strength at temperature and after annealing. Elevated temperature nanoindentation showed a reduction in the temperature sensitivity of hardness as individual layer thickness decreases (i.e. thinner layers retain strength better at elevated temperatures). This is explained using the confined layer slip model which suggests the drop in stress is due to both changes in the shear modulus of the film as well as dislocation/interface interactions. Molecular dynamic simulations of Cu/Nb bi-layers are presented in support of the concept that dislocation interactions at incoherent interfaces are less temperature sensitive than dislocation-dislocation interactions within the layers, supporting the experimental results.
Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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