| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10669816 | Thin Solid Films | 2012 | 4 Pages |
Abstract
⺠Impact of encapsulating dielectric properties on post-packaging device failure rate. ⺠Encapsulating dielectric layer characteristics influence device failure rate. ⺠Device failure rate increases with the effective Young's modulus of encapsulating dielectric. ⺠Increase in SiOH concentration in dielectrics results in a decrease in SiOx Young's modulus. ⺠Device failure rate reduces with increase in SiOH concentration in the SiOx.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Chukwudi A. Okoro, Yaw S. Obeng,