| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10669830 | Thin Solid Films | 2012 | 5 Pages |
Abstract
⺠Morphology of electroless Cu on glass characterized as a function of plating time. ⺠The deposition rate of electroless Cu varied with deposition time. ⺠The roughness and grain size of the Cu deposits increased with the plating time. ⺠The resistivity of Cu films was measured and related to changes in microstructure.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Xiaoyun Cui, David A. Hutt, Paul P. Conway,