| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10669935 | Thin Solid Films | 2012 | 7 Pages |
Abstract
⺠Critical oxide thickness for Pb free solder on Cu substrate is 18 ± 5 nm. ⺠Above the critical oxide, non-wet solder joint increases exponentially. ⺠A maximum 13-nm oxide thickness is suggested for good solder joint. ⺠Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. ⺠Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
C. Key Chung, Y.J. Chen, C.C. Li, C.R. Kao,