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Preparation of porous alumina abrasives and their chemical mechanical polishing behavior

Article ID Journal Published Year Pages File Type
10670103 Thin Solid Films 2012 5 Pages PDF
Abstract
► We prepared porous alumina abrasives with different pore sizes. ► The polished surface roughness decreases when pore diameter of porous alumina increases. ► The porous alumina has lower polished surface roughness than solid alumina.
Keywords
Hard disk substrateChemical mechanical polishing (CMP)Planarization
Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
Preview
Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
Authors
Hong Lei, Xin Wu, Ruling Chen,
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Thin Solid Films
Journal: Thin Solid Films
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