Article ID Journal Published Year Pages File Type
10670272 Thin Solid Films 2012 4 Pages PDF
Abstract
► Diffusion bonding of TiAl to TiC cermet was realized using Al/Ni multilayer. ► The reaction sequence of the Al/Ni multilayers was Al3Ni → Al3Ni2 → AlNi → AlNi3. ► The interfacial microstructure of the joint was clarified. ► The application of Al/Ni multilayers improved the joining quality.
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Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
Preview
Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet
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