| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10671003 | Thin Solid Films | 2005 | 8 Pages |
Abstract
Annealing of low-temperature alloy films gives rise to irreversible tensile stress changes indicating restructuring of the films. The stress change measured when annealing a superstructured γ-TiCu film is compressive and is assigned to the transformation of the metastable superstructure to polycrystalline γ-TiCu. The magnitude of this compressive stress contribution is strongly dependent on the copper concentration, i.e., copper vacancy concentration.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
St. Bertel, R. Abermann,