Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10673243 | CIRP Annals - Manufacturing Technology | 2009 | 4 Pages |
Abstract
This paper proposes a method of electrochemical micromachining of micro hole or dimple array, in which a patterned insulation plate coated with metal film as cathode is closely attached to workpiece plate. When voltage is applied across the workpiece and cathode film over which the electrolyte flows at high speed, hole or dimple array will be produced. The proposed technology offers unique advantages such as short lead time and low cost. The effect of process parameters on the microstructure shape was demonstrated numerically and experimentally. Arrays of holes or dimples of several hundred micrometers diameter have been produced.
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
D. Zhu, N.S. Qu, H.S. Li, Y.B. Zeng, D.L. Li, S.Q. Qian,