Analysis of laser micromachining in silica glass with an absorbent slurry

The authors have investigated a method for machining a 3D microchannel in silica glass using a UV nanosecond pulsed laser and an absorbent slurry. 3D microstructures in glass materials are required for optical waveguides, microfluidic chips, etc. The depths of the grooves and holes produced in the silica glass were found to be proportional to the number of laser pulses. The material removal process in the proposed method was the melting of the glass by heat transfer from the absorbent particles, which were attached to the surface of the glass, providing for strong laser absorption.