Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10673626 | CIRP Annals - Manufacturing Technology | 2008 | 6 Pages |
Abstract
This paper presents the potential of a superabrasive electroplated grinding wheel with a defined grain pattern for dry surface grinding operations. The grinding wheel's grain pattern is developed by kinematic simulation with special focus on the undeformed chip thickness. Current experimental investigations of dry grinding operations of hardened heat-treated steel are carried out with a material removal rate of Qâ²w=70mm3/mms. The measured grinding forces, workpiece temperatures, as well as workpiece surface quality and workpiece integrity are compared to wet grinding and a standard superabrasive electroplated grinding wheel as a reference process.
Keywords
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Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
J.C. Aurich, P. Herzenstiel, H. Sudermann, T. Magg,