Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10674025 | CIRP Annals - Manufacturing Technology | 2011 | 4 Pages |
Abstract
Demand for diminishing edge roll off while polishing surfaces such as those of silicon wafers and glass disks has currently exceeded the capabilities of existing technologies. To address this problem, the influence of polishing pad properties on the stress distribution near the workpiece edge was investigated using finite element methods. Based on the results, double-layered polishing pads having an extra-fine fiber thin layer and a hard polymer layer were developed. Polishing experiments on silicon wafers and glass plates showed that the developed polishing pads achieved high finishing efficiency and improved surface flatness near the edge.
Keywords
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Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
T. Enomoto, U. Satake, T. Miyake, N. Tabata,