Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10674398 | CIRP Annals - Manufacturing Technology | 2013 | 4 Pages |
Abstract
Nano-second pulsed laser irradiation was used to recover machining-induced damage under curved surfaces of single-crystal silicon. Microstructural changes of silicon due to laser irradiation were characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. The recoverable damage depth was predicted by finite element modeling of laser-induced temperature change in the workpiece material. Slanted irradiation experiments were performed and the critical surface inclination angle for complete recovery was experimentally obtained. The results demonstrate that atomic-level subsurface integrity and nanometric surface roughness can be achieved on large-curvature silicon surfaces, such as the surfaces of toroidally shaped wafer edges.
Keywords
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Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Jiwang Yan, Fuminori Kobayashi,