Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10674503 | CIRP Annals - Manufacturing Technology | 2007 | 4 Pages |
Abstract
To obtain scientific guidelines for ductile-mode machining, nano-indentation, nano-bending, and nano-machining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.
Keywords
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Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
H. Tanaka, S. Shimada, L. Anthony,