| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10709428 | Journal of Magnetism and Magnetic Materials | 2012 | 4 Pages |
Abstract
⺠TiW seed layer improves the texture of Cu under layer. ⺠TiW seed layer decreases the surface roughness of Cu underlayer. ⺠A 5 nm TiW seed layer significantly improves the perpendicular coercivity of SmCo5 film. ⺠Diffusion barrier and a high melting point of TiW seed layer are the physical mechanism of the improvement for SmCo5 film with perpendicular magnetic anisotropy.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
Weiming Cheng, Wenwu Liu, Xiao Wang, Yifan Dai, Xiaomin Cheng, Xiangshui Miao,