Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10726974 | Physics Letters A | 2012 | 5 Pages |
Abstract
⺠Classical molecular dynamic simulations for nanocrystalline copper. ⺠Morphology-dependent mechanical properties. ⺠Degradation of materials property under thermal load. ⺠Different grain-size behaviors of mechanical properties under thermal load.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Physics and Astronomy (General)
Authors
Yongsoo Choi, Youngho Park, Sangil Hyun,