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Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

Article ID Journal Published Year Pages File Type
11015821 Journal of Alloys and Compounds 2019 8 Pages PDF
Keywords
High temperature storageMicrostructureReliabilityDie attach
Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
Preview
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
Authors
Hongqiang Zhang, Wengan Wang, Hailin Bai, Guisheng Zou, Lei Liu, Peng Peng, Wei Guo,
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Journal
Journal of Alloys and Compounds
Journal: Journal of Alloys and Compounds
Related Categories
High temperature storage
Microstructure
Reliability
Die attach
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