Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
11016320 | International Journal of Adhesion and Adhesives | 2018 | 19 Pages |
Abstract
Cost savings are realized when phenol formaldehyde (PF) and polymeric methylene diphenyl diisocyanate (pMDI) resins are partially substituted with soy flour during the manufacture of engineered woods such as oriented strand board. The interaction of soy flour with the two resins was studied through thermogravimetric analysis, Fourier transform infrared spectroscopy, and mass spectroscopy. No significant differences in the results from all three analyses were observed between neat PF and PF resin partially (up to 30%) substituted with soy flour, suggesting that chemical bonding between soy flour and PF resin was minimal. In contrast, soy flour induced major changes in the thermogravimetric and spectroscopic properties when substituted in pMDI resin because of chemical cross-linking between the two species.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
William G. Hand, W. Robert Ashurst, Brian Via, Sujit Banerjee,