| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 11026630 | Micron | 2019 | 17 Pages |
Abstract
We report, for the first time, the three dimensional reconstruction (3D) of a transistor from a microprocessor chip and roughness of molecular electronic junction obtained by electron tomography with Hole Free Phase Plate (HFPP) imaging. The HFPP appears to enhance contrast between inorganic materials and also increase the visibility of interfaces between different materials. We demonstrate that the degree of enhancement varies depending on material and thickness of the samples using experimental and simulation data.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Misa Hayashida, Kai Cui, Amin Morteza Najarian, Richard McCreery, Neerushana Jehanathan, Chris Pawlowicz, Sohei Motoki, Masahiro Kawasaki, Yuji Konyuba, Marek Malac,