| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 12055133 | Materials Science and Engineering: A | 2019 | 28 Pages |
Abstract
The mechanism of hydrogen-induced void closure during diffusion bonding (DB) process of hydrogenated Ti-55 alloy with different hydrogen contents at different temperatures has been investigated. When bonded at 700â¯Â°C, bonding ratio and shear strength prominently improve with the increase of hydrogen content, which results from residual hydrogen in bonded sample. Hydrogen can increase the fractions of high angle grain boundaries (HAGBs) and β phase as well as break up original long-strip α grains. However, hydrogen almost escapes from hydrogenated alloy when bonded at 800â¯Â°C. Then bonding ratio and shear strength slightly increase with increasing hydrogen content. It attributes to grain refinement and volume fraction increase of β phase. Therefore, residual hydrogen plays a key role in improving diffusion bonding properties during DB process.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Huiping Wu, Heli Peng, Xifeng Li, Jun Chen,