Article ID Journal Published Year Pages File Type
1264756 Organic Electronics 2011 7 Pages PDF
Abstract

We investigate the heat transfer property of thin-film encapsulation (TFE) for organic light-emitting diodes (OLEDs). It is demonstrated that the TFE combined with a flexible heat sink shows better thermal performance, compared with the epoxy-filled glass encapsulation and the conventional glass encapsulation. By way of experiments and simulations, we verify that the multi-heterojunction configuration and the low thermal conductivity of the polymer layer in the TFE film have no impact on the thermal performance. Furthermore, we find through simulations that a significant temperature gradient appears inside the TFE layers only when the thermal conductivity of the polymer is lower than 1 × 10−3 W/m K. This enables us to perform design optimization of the TFE configuration with relaxed heat dissipation.

Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideResearch highlights► We investigate the heat transfer property of thin-film encapsulation (TFE) for OLEDs. ► The TFE structure combined with a flexible heat sink shows the best thermal performance. ► The multi-heterojunction configuration and the low thermal conductivity of the polymer layer in the TFE film have no impact on the thermal performance.

Related Topics
Physical Sciences and Engineering Chemistry Chemistry (General)
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