Article ID Journal Published Year Pages File Type
1333499 Journal of Solid State Chemistry 2006 10 Pages PDF
Abstract

We explore wet and dry etching processes of thin MnAs layers grown on GaAs(0 0 1) substrates for microstructuring. Most of the common wet chemical etch solutions for GaAs react with MnAs strongly and in a peculiar manner. Unidirectional cracks are generated when the MnAs layers are thicker than 100 nm. We demonstrate that the crack generation can be avoided by choosing a suitable etch solution or etch temperature. We fabricate submicrometer-wide MnAs wires using Ar ion milling. The resistivity of the narrow channels is measured over a temperature range covering the phase transitions in MnAs between the αα, ββ, and γγ phases. The resistivity along the MnAs[0 0 0 1] direction is found to be smaller than that along the MnAs[112¯0] direction regardless of the phase. A nearly linear temperature variation of the phase fraction is deduced in the αα–ββ phase coexistence regime. The temperature coefficients of the resistivities are negative for the nonmagnetic phases.

Surface of a partly etched MnAs film grown on a GaAs(001) substrate.Figure optionsDownload full-size imageDownload as PowerPoint slide

Related Topics
Physical Sciences and Engineering Chemistry Inorganic Chemistry
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