Epoxy as a reactive plasticizer for improving polycarbonate processibility

An oligomer of a diepoxy (diglycidyl ether of bisphenol-A, DGEBA) and an aromatic diamine (MCDEA) have been used as reactive plasticizers for polycarbonate (PC). A small amount of PC chain scission occurred during this blending process, probably due to transesterification of the PC carbonate group by the hydroxyl group of the DGEBA oligomer. Addition of DGEBA to PC was found to greatly reduce the Tg and processing temperature. Dynamic rheology measurements showed that the added epoxy can very effectively reduce the viscosity, but that the addition of epoxy also accelerated the crystallisation rate of the PC, which was confirmed by XRD, optical transmission microscopy and DMTA. The DMTA results of cured blends also showed that this crystallization of the PC enhanced their heat resistance properties. Sol–gel studies of the cured samples showed that some of the PC was grafted to the crosslinked epoxy network. Studies of the rubbery behaviour, solvent resistance of the cured blend and SEM images suggest that PC is the main continuous phase in the matrix and that the epoxy phase is mainly dispersed as sub-micron particles in the matrix.

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