Article ID Journal Published Year Pages File Type
1445884 Acta Materialia 2013 18 Pages PDF
Abstract

The dominant mechanics and mechanisms of fatigue crack propagation in ca. 500 nm thick free-standing copper films were evaluated at the submicron level using fatigue crack propagation experiments at three stress ratios, R = 0.1, 0.5 and 0.8. Fatigue cracking initiated at the notch root and propagated stably under cyclic loading. The fatigue crack propagation rate (da/dN) vs. stress intensity factor range (ΔK) relation was dependent on the stress ratio R;da/dN, increases with increasing R. Plots of da/dN vs. the maximum stress intensity factor (Kmax) exhibited coincident features in the high-Kmax region (Kmax ⩾ 4.5 MPa m1/2) irrespective of R, indicating that Kmax is the dominant factor in fatigue crack propagation. In this region, the fatigue crack propagated in tensile fracture mode irrespective of the R value. The region ahead of the fatigue crack tip is plastically stretched by tensile deformation, causing necking deformation in the thickness direction and consequent chisel-point fracture. In contrast, in the low-Kmax region (Kmax < 4.5 MPa m1/2), the da/dN vs. Kmax function assumes higher values with decreasing R; in this region, the fracture mechanism depends on R. At the higher R value (R = 0.8), the fatigue crack propagates in the tensile fracture mode similar to that in the high-Kmax region. On the other hand, at the lower R values (R = 0.1 and 0.5), a characteristic mechanism of fatigue crack propagation appears: within several grains, intrusions/extrusions form ahead of the crack tip along the Σ3 twin boundaries, and the fatigue crack propagates preferentially through the intrusions/extrusions.

Related Topics
Physical Sciences and Engineering Materials Science Ceramics and Composites
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