| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1447148 | Acta Materialia | 2011 | 9 Pages |
The grain boundary–free surface triple line tension and grain boundary triple line tension were investigated in copper using a recently introduced novel approach. The effect of triple line tension on grain growth, Zener drag and Gibbs–Thompson relation was studied. The results showed that the triple line tension has a considerable effect on grain growth, particle–boundary interactions and void shape, especially for nanocrystalline materials.
► The effect of triple junctions on a variety of metallurgical phenomena was investigated. ► For copper the groove root triple line energy was determined as 1.5 E-8 J/m. ► For copper the grain boundary triple line energy was determined as 6 E-9 J/m ► In nanocrystalline materials the triple line energy contributes to the driving force for grain growth. The triple line energy prevents a grain boundary to wet nanoscopic particles and voids.
