Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1447657 | Acta Materialia | 2011 | 13 Pages |
The synchronized lateral spreading and through-penetration of liquid and solid gallium (Ga) in supported thin polycrystalline films of silver (Ag) were studied. The spreading and penetration kinetics were presumably controlled by a common mechanism. The spreading rate in the 0.5 μm thick film was found to be constant with time. The activation energies of the process responsible for spreading/penetration of liquid and solid Ga were EL ≈ 28.9 ± 4.8 kJ mol−1 and ES ≈ 48.2 ± 9.6 kJ mol−1, respectively. Grain boundary grooving, with Ag diffusion out of the groove either through liquid Ga or through solid Ga, was suggested as a possible mechanism of the spreading and penetration. The model proposed reproduced the observed spreading/penetration rates and gave reasonable estimates of the energies ES and EL.