The mechanisms of interfacial failure for lateral force-sensing microindentation test: finite element analysis

The interfacial bond strength for coatings and composites can be quantitatively determined using a newly developed lateral force-sensing microindentation method. In this study, a finite element analysis was made to investigate the interfacial failure mechanisms for Cu–ceramic and Al alloy–ceramic interfaces. The model is validated by comparing obtained results of the finite element analysis with analytical solutions. Two different interfacial failure mechanisms, depending on material properties and microindentation positions, are proposed. As demonstrated, interfacial debonding may result from shear stress or a coupling of tensile stress and shear stress at the interface, corresponding to material “pile-up” deformation or “sink-in” deformation. In addition, the high sensitivity of the lateral force response to interfacial debonding, associated with two different interfacial failure mechanisms, is also examined.