Highly reinforced and cube textured Ni alloy composite substrates by a hybrid route

A Ni-based tri-layer composite substrate designed as a substitute for traditional substrate architecture, was obtained by sintering together two Ni–5 at.%W layers on both sides of a metallurgically prepared powder Ni–12 at.%W inner layer. An advanced sparking plasma sintering technology was used, followed by cold rolling and annealing. The composite substrates obtained have a very sharp cube texture on the Ni–5 at.%W outer layer and the yield strength exceeds 320 MPa, while the magnetization behaviour was dramatically reduced. These properties render these tri-layer substrates suitable for the epitaxial growth of buffer layers for coated conductor applications.