Toughness measurement and toughening mechanisms of arc ion plating Cr2O3 films treated by annealing

Chromium sesquioxide (Cr2O3) films were deposited on Ni-based high-temperature alloy substrates by an arc ion plating technique and then annealed at different temperatures and heating rates. The influence of annealing conditions on the toughness of Cr2O3 films was calculated according to spherical indentation tests. The increase in grain size and compressive stress, variety of microstructure and surface morphology, and atom diffusion that resulted from annealing caused toughness variations. The increase in grain size closed micro-cracks along the direction of film growth. Compressive stress and a multi-crystal plane led to cracks caused by indentation that required more energy to break through the film. In the process of indentation, turning, bifurcating, and bridging of cracks on film surface was also able to dissipate energy. Atom diffusion in the process of 1000 °C annealing also played a role in grain boundary toughening. The toughness improvement of Cr2O3 film significantly improved friction life.