| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1460441 | Ceramics International | 2015 | 7 Pages |
Abstract
The microstructure and bonding strength of vacuum-brazed C/C composite and C/C composite with inactive AgCu foil are studied. The interface structure of the brazed joint consists of the TC4/Ti2Cu+Ti(ss)/Ti2Cu/TiCu/Ag(ss)+Ti3Cu4/TiC/C/C composites. The maximum shear strength of the joint is 33 MPa at 880 °C for 10 min and Ti diffusing from TC4 into the filler improves the wettability on the C/C composite. The interface evolution during the brazing process and associated mechanism are discussed.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Wei Guo, Lin Wang, Ying Zhu, Paul K Chu,