Article ID Journal Published Year Pages File Type
1464790 Ceramics International 2007 4 Pages PDF
Abstract
Al2O3 coatings, with a Ni-based buffer layer (Ni or NiAl), were deposited on a Cu substrate by electron beam evaporation (EBE). The Al2O3 coatings were amorphous of good stoichiometry and their surface was undulated and continuous. The Ni-based buffer layer played a key role on improving the adhesion of the Al2O3 coatings to the substrate. The diffusion of Cu from the substrate into the Al2O3 coating at high temperature was suppressed by the buffer layer. Excellent resistivity (1015 Ω cm) and high breakdown voltage (110 kV/mm) have been obtained.
Related Topics
Physical Sciences and Engineering Materials Science Ceramics and Composites
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