| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1465060 | Ceramics International | 2008 | 5 Pages |
Abstract
The wetting of Ti–Cu alloys on Si3N4 was analyzed by the sessile drop method, using an imaging system with a CCD camera during the heating under argon flow. The contact angle was measured as a function of temperature and time. The samples were cut transversally and characterized by scanning electron microscopy and energy dispersive spectrometry (SEM/EDS). Wettability of the Ti–Cu alloy on Si3N4 is influenced by the reaction between the Ti and the ceramic. The TC1 and TC2 alloys presented low final contact angle values around 2° and 26°, respectively, indicating good wetting on Si3N4.
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Authors
A.P. Luz, S. Ribeiro,