| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1469743 | Corrosion Science | 2011 | 4 Pages |
A thin layer electrochemical cell was successfully developed to study the atmospheric corrosion behavior of copper film in printed circuit board (PCB-Cu) under thin electrolyte layer (TEL) and direct current electric field (DCEF) by electrochemical impedance and electrochemical noise analysis. The electrochemical measurements and SEM morphologies after corrosion test indicate that DCEF decreases the corrosion of PCB-Cu under TEL. The corrosion rate and probability of pitting corrosion of PCB-Cu under DCEF decrease due to the electric migration of aggressive Cl− ion out of working electrode surface.
► In situ study on atmospheric corrosion under thin electrolyte layer. ► In situ study on atmospheric corrosion under direct current electric field. ► Effect of direct current electric field on atmospheric corrosion mechanism.
