| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1472260 | Corrosion Science | 2006 | 15 Pages |
Abstract
The corrosion process in the Cu/CuSO4Â +Â H2SO4 system is considered as the sum of two coupled single-electron electrochemical reactions that occur simultaneously and independently on the surface of the copper electrode. Our numerical model incorporates diffusion and migration of solution species including cuprous ions, as well as the chemical equilibria for copper sulphate and sulphuric acid dissociation. Numerical simulations are compared with the trends discovered during experimental investigation of copper corrosion in similar systems.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
A.G. Zelinsky, B.Ya. Pirogov,