Article ID Journal Published Year Pages File Type
1475298 Journal of the European Ceramic Society 2012 13 Pages PDF
Abstract

The residual stresses due to the difference in thermal expansion between ceramic and metal is a significant parameter to control during the fabrication of ceramics/metal joint. In this work, residual stress distribution, after solid state bonding of different joints, was measured using X-ray diffraction (XRD) and Vickers Indentation Fracture (VIF) methods. Tensile stress concentration in alumina caused by the thermal expansion mismatch in the Al2O3/Ni/Ni alloy (HAYNES® 214™) joint severely deteriorated the assembly and caused cracks in alumina. To solve this problem, this paper shows that the use of a Cu/Ni/Cu multi-layer, associated with the direct copper bonding method (DCB), by pre-oxidation of copper, reduces significantly the tensile residual stresses in alumina material. Consequently, this process offers the possibility of producing an interlayer with a high melting temperature and hence joints which can withstand high-temperatures.

Related Topics
Physical Sciences and Engineering Materials Science Ceramics and Composites
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