Strength and fracture analysis of silicon-based components for embedding

Single-crystalline silicon chips are widely employed in printed circuit boards (PCBs) as embedded components. Their design often requires one side patterned with metal contacts, whereas the opposite one is constituted by pure silicon. These components must possess a minimum strength to withstand the loads occurring during both production and operation of the board. In this work, the strength and fracture behaviour of miniaturised Si chips (dimensions: 2 mm × 2 mm × 0.125 mm) has been assessed under biaxial loading on both the pure silicon side and the metal-patterned side by means of a miniaturised ball-on-three-balls (B3B) fixture. Experimental results showed significant difference in the characteristic fracture load between the silicon-side (P0 = 21.2 N, Weibull modulus m ≈ 2.6) and the metal-patterned side (P0 = 8.6 N, m ≈ 12.3). Fracture mechanics and fractographic analyses, together with FE simulations of the loading process, helped clarifying the effect of the metal contacts on the overall fracture behaviour of the Si-chips.