| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1476695 | Journal of the European Ceramic Society | 2007 | 4 Pages |
Abstract
Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Polina V. Kapitanova, Alexander V. Simine, Dmitry V. Kholodnyak, Irina B. Vendik,