In situ measurement of dimensional changes and temperature fields during sintering with a novel thermooptical measuring device

With a novel thermooptical measuring device (TOM) dimensional changes are investigated during sintering of components and samples up to 50 mm in size. Sintering shrinkage is measured without contact using an optical method. This optical method additionally enables the monitoring of warpage, cracking and caking phenomena which often occur in developing new sintering processes. Creep, caused by uniaxial loading of the samples, can also be measured in the axial and transverse direction. Simultaneously, thermal diffusivity and heat transfer coefficients are measured by the laser-flash technique. Material properties are obtained by an inverse simulation of the temperature distribution in the sample.