Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498249 | Scripta Materialia | 2014 | 4 Pages |
Abstract
Thick Cu and Cu–Al films were sputtered under identical conditions. A wide range of stacking fault energies (6–78 mJ m−2) were explored in order to manipulate the twin spacing and microstructure. The Cu–Al samples showed highly columnar and nanotwinned grains, while the Cu sample showed a limited number of nanotwinned grains. The effects of changes in sputtering rate were also evaluated and compared to theoretical calculations. It was observed that, contrary to predictions, the twin spacing increased at higher sputtering rates.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Leonardo Velasco, Mikhail N. Polyakov, Andrea M. Hodge,