Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498315 | Scripta Materialia | 2015 | 4 Pages |
Abstract
Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240–300 °C for 10–50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Chanho Shin, Sung Woo Ma, Jeong Hwan Lee, Ki Bum Kim, Minsuk Suh, Namseog Kim, Young-Ho Kim,