| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1498532 | Scripta Materialia | 2015 | 4 Pages |
Abstract
A new sintering mechanism is revealed for copper powder sintered under the influence of an electrical field and a force field during the formation of microcomponents. Analysis of the microstructure and grain boundary evolution of the sintered samples showed that the disappearance of the interface at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative microsintering process. The densification process is therefore different from what is known in a conventional powder sintering process.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Kunlan Huang, Yi Yang, Yi Qin, Gang Yang, Deqiang Yin,