Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498634 | Scripta Materialia | 2014 | 4 Pages |
Abstract
Electron current stressing of Ni/Sn3Ag/Ni solder joints was conducted in a straight-line configuration to avoid the complication of current crowding. It was confirmed that Sn grain orientation dominated the dissolution of the Ni substrate and the precipitation of intermetallic inside Sn3Ag. Current crowding played no role here. Additionally, it was found that the direction of serrated cathode dissolution exhibited a strong correlation with Sn grain orientation. These effects were explained in terms of the extreme anisotropy of Ni diffusion in Sn.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
T.C. Huang, T.L. Yang, J.H. Ke, C.H. Hsueh, C.R. Kao,