Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498698 | Scripta Materialia | 2013 | 4 Pages |
Abstract
The formation of submicrocrystalline (SMC) Ti–6Al–4V was achieved by imposing a much lower strain (ε = 1.4) compared to that typically imposed during severe plastic deformation operations (i.e. 4 ⩽ ε ⩽ 8). Electron backscatter diffraction analysis revealed that the novel process was effective in promoting dynamic recrystallization and limiting α grain growth. The SMC sheet had much higher yield strength than usual (1134 MPa) and reasonable elongation (∼12%) at room temperature, and exhibited enhanced ductility at elevated temperatures.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Chan Hee Park, Jeoung Han Kim, Jong-Taek Yeom, Chang-Seok Oh, S.L. Semiatin, Chong Soo Lee,