| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1498802 | Scripta Materialia | 2013 | 4 Pages |
Abstract
Electroplating was used to fabricate a high density of nanotwins that exhibited the preferred (1 1 1) orientation in Cu. We found no formation of Kirkendall voids in solder reactions on the nanotwinned Cu. This was due to the high density of steps and kinks on the nanotwin boundaries, which serve as vacancy sinks. Thus the vacancy concentration cannot reach supersaturation and nucleate voids. The finding is a significant advance in the problem of solder joint reliability in microelectronic three-dimensional integrated circuit devices.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Tao-Chi Liu, Chien-Min Liu, Yi-Sa Huang, Chih Chen, King-Ning Tu,