| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1498821 | Scripta Materialia | 2013 | 4 Pages |
Abstract
The microstructural evolution of the intermetallic compound (Cu6Sn5) in Sn–xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the Cu6Sn5 was also investigated under thermal aging for comparison. The only XRD crystalline peak (3¯14) of Cu6Sn5 that was detected disappeared under current stress, but not under thermal aging. Ex situ SEM observation of the Cu6Sn5 crystal revealed an anisotropic dissolution behavior. The kinetics of the anisotropic dissolution was also investigated.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Wei-Yu Chen, Tsung-Chieh Chiu, Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Hsin-Yi Lee,