Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498854 | Scripta Materialia | 2013 | 4 Pages |
Abstract
The surface mechanical attrition treatment (SMAT) process was applied to pure Cu at both cryogenic and room temperatures. The cryogenic SMAT process resulted in a 60% reduction of grain size in the polycrystalline microstructure compared to that at room temperature. The level of grain refinement is related to a transition in the dominant deformation mechanism during SMAT from a dislocation-mediated behavior at room temperature to a twinning/shear band-mediated behavior at cryogenic temperatures, which also helps to suppress thermally activated processes.
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Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
K.A. Darling, M.A. Tschopp, A.J. Roberts, J.P. Ligda, L.J. Kecskes,