| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1498884 | Scripta Materialia | 2012 | 4 Pages |
Abstract
Shear fracture behaviors of Cu/Sn–3Cu/Cu joints with different solder dimensions were investigated. The experimental results demonstrate that, with decreasing ratio R of the solder thickness to length, the interfacial shear strength increased and the fracture mode changed from ductile to a mixture of ductile and brittle. Based on the interfacial stress analysis across the solder joint, a hyperbolic formula expressing the relationship between the interfacial shear strength and the ratio R was proposed.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
L.M. Yang, Q.K. Zhang, Z.F. Zhang,