Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1498924 | Scripta Materialia | 2013 | 4 Pages |
Abstract
We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Riko. I Made, Eric Jian Rong Phua, Stevin Snellius Pramana, Chee Cheong Wong, Zhong Chen, Alfred Iing Yoong Tok, Chee Lip Gan,