| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499048 | Scripta Materialia | 2013 | 4 Pages |
Abstract
Sn–3.5Ag–xFe (x = 0.1, 0.5, 1.0 and 2.0 wt.%) solders were reacted with electroplated Cu under bump metallization and the characteristics of Kirkendall void formation at the solder joints were investigated. An electroplating process was carried out in a Cu sulfate bath with an additive. The results show that the formation of Kirkendall voids at the solder joint decreased with the Fe content due to the scavenging of S originating from the additive.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
S.H. Kim, Jin Yu,