| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499192 | Scripta Materialia | 2013 | 4 Pages |
Abstract
In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Seong-Woong Kim, Huck Beng Chew, K. SharvanKumar,